WM8904 データシートの表示（PDF） - Wolfson Microelectronics plc
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WM8904 Datasheet PDF : 188 Pages
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Pre-Production
PACKAGE DIMENSIONS
The 36-ball W-CSP package drawing is shown below.
B: 36 BALL W-CSP PACKAGE 2.651 X 2.525 X 0.698mm BODY, 0.40 mm BALL PITCH
WM8904
DM066.C
2
A
g A2
DETAIL 2
6
A
B
C
D
E
F
DETAIL 1
5
4
3
2
1
e5
E1
e
ddd M Z A B
D1
BOTTOM VIEW
A1
CORNER
2X
2X
aaa B
aaa A
bbb Z
1
Z
A1
ccc Z
DETAIL 2
4
D
A
E
4
TOP VIEW
B
f1
DETAIL 1
f2
h
Symbols
A
A1
A2
D
D1
E
E1
e
f1
f2
g
h
aaa
bbb
ccc
ddd
MIN
0.663
0.177
0.452
2.626
2.500
0.313
0.250
0.218
Dimensions (mm)
NOM
MAX
0.698
0.733
0.208
0.239
0.468
0.484
2.651
2.676
2.000 BSC
2.525
2.550
2.000 BSC
0.400 BSC
0.022
0.258
0.025
0.060
0.030
0.015
0.298
NOTE
5
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
w
PP, Rev 3.3, September 2012
185
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