74HC245DB,118 データシートの表示（PDF） - NXP Semiconductors.

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コンポーネント説明

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74HC245DB,118

Octal bus tranceiver; 3-state

NXP Semiconductors. 

Philips Semiconductors

13. Package outline

DIP20: plastic dual in-line package; 20 leads (300 mil)

74HC245; 74HCT245

Octal bus tranceiver; 3-state

SOT146-1

D

L

Z

20

e

b

pin 1 index

1

A2 A

A1

wM

b1

11

ME

c

(e 1)

MH

E

10

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A

max.

A1

min.

A2

max.

b

b1

c

D (1)

E (1)

e

e1

L

ME

MH

w

Z (1)

max.

mm

4.2

0.51

3.2

1.73

1.30

0.53

0.38

0.36 26.92 6.40

0.23 26.54 6.22

2.54

7.62

3.60

3.05

8.25

7.80

10.0

8.3

0.254

2

inches 0.17

0.02

0.13

0.068 0.021 0.014 1.060

0.051 0.015 0.009 1.045

0.25

0.24

0.1

0.3

0.14

0.12

0.32

0.31

0.39

0.33

0.01 0.078

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

IEC

SOT146-1

REFERENCES

JEDEC

JEITA

MS-001

SC-603

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-13

Fig 8. Package outline SOT146-1 (DIP20)

9397 750 14502

Product data sheet

Rev. 03 — 31 January 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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