BC859CLT3 データシートの表示（PDF） - ON Semiconductor
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BC859CLT3 Datasheet PDF : 8 Pages
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BC856ALT1 Series
PACKAGE DIMENSIONS
A
L
3
1
2
BS
V
D
G
C
H
SOT−23 (TO−236)
CASE 318−09
ISSUE AI
KJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318−01, −02, AND −06 OBSOLETE, NEW STANDARD 318−09.
INCHES
DIM MIN MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0385 0.0498
D 0.0140 0.0200
G 0.0670 0.0826
H 0.0040 0.0098
J 0.0034 0.0070
K 0.0180 0.0236
L 0.0350 0.0401
S 0.0830 0.0984
V 0.0177 0.0236
STYLE 6:
PIN 1.
2.
3.
BASE
EMITTER
COLLECTOR
MILLIMETERS
MIN MAX
2.80
3.04
1.20
1.40
0.99
1.26
0.36
0.50
1.70
2.10
0.10
0.25
0.085 0.177
0.45
0.60
0.89
1.02
2.10
2.50
0.45
0.60
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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