HI-8570CRTF(2006) データシートの表示（PDF） - Holt Integrated Circuits
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HI-8570CRTF Datasheet PDF : 8 Pages
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HI-8570, HI-8571
PACKAGE THERMAL CHARACTERISTICS
PACKAGE STYLE1
8 Lead Plastic ESOIC5
Maximum ARINC Load
ARINC 429 SUPPLY CURRENT (mA)2
DATA RATE Ta = 25°C Ta = 85°C Ta = 125°C
Low Speed3
20.98
20.96
20.96
High Speed4
26.40
26.16
25.96
JUNCTION TEMP, Tj °C
Ta = 25°C Ta = 85°C Ta = 125°C
38.24
98.34 138.92
44.78 104.66 144.59
PACKAGE STYLE1
8 Lead Plastic ESOIC5
TXAOUT and TXBOUT Shorted to Ground 6,7,8
ARINC 429 SUPPLY CURRENT (mA)2 JUNCTION TEMP, Tj °C
DATA RATE Ta = 25°C Ta = 85°C Ta = 125°C Ta = 25°C Ta = 85°C Ta = 125°C
Low Speed3
High Speed4
30.26
30.44
29.22
29.42
28.46
28.68
53.75
53.92
112.76
112.95
152.04
152.25
Notes:
1. All data taken in still air.
2. At 100% duty cycle, 5V power supplies.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered.
6. Similar results would be obtained with TXAOUT shorted to TXBOUT.
7. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
8. Data will vary depending on air flow and the method of heat sinking employed.
HEAT SINK - ESOIC PACKAGES
An 8-pin thermally enhanced SOIC package is used for the
HI-8570/HI-8571 products. The ESOIC package includes
a metal heat sink located on the bottom surface of the
device. This heat sink should be soldered down to the
printed circuit board for optimum thermal dissipation. The
heat sink is electrically isolated from the chip and can be
soldered to any ground or power plane. However, since
the chip’s substrate is at V+, connecting the heat sink to
this power plane is recommended to avoid coupling noise
into the circuit.
HOLT INTEGRATED CIRCUITS
5
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