HI-8570, HI-8571
PACKAGE THERMAL CHARACTERISTICS
PACKAGE STYLE1
8 Lead Plastic ESOIC5
Maximum ARINC Load
ARINC 429 SUPPLY CURRENT (mA)2
DATA RATE Ta = 25°C Ta = 85°C Ta = 125°C
Low Speed3
20.98
20.96
20.96
High Speed4
26.40
26.16
25.96
JUNCTION TEMP, Tj °C
Ta = 25°C Ta = 85°C Ta = 125°C
38.24
44.78
98.34
104.66
138.92
144.59
PACKAGE STYLE1
8 Lead Plastic ESOIC5
TXAOUT and TXBOUT Shorted to Ground 6,7,8
ARINC 429 SUPPLY CURRENT (mA)2 JUNCTION TEMP, Tj °C
DATA RATE Ta = 25°C Ta = 85°C Ta = 125°C Ta = 25°C Ta = 85°C Ta = 125°C
Low Speed3
High Speed4
30.26
30.44
29.22
29.42
28.46
28.68
53.75
53.92
112.76
112.95
152.04
152.25
Notes:
1. All data taken in still air.
2. At 100% duty cycle, 5V power supplies.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF
as this is considered unrealistic for high speed operation.
5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered.
6. Similar results would be obtained with TXAOUT shorted to TXBOUT.
7. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.
8. Data will vary depending on air flow and the method of heat sinking employed.
HOLT INTEGRATED CIRCUITS
5