HSMX-C170 データシートの表示（PDF） - Avago Technologies
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HSMX-C170 Datasheet PDF : 12 Pages
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THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 20. Tape leader and trailer dimensions.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.)unless otherwise specified.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
>10% when read at 23 ± 5°C.
b) Device exposed to factory
conditions <30°C/60% RH
more than 672 hours.
Baking recommended condition: 60
+/– 5˚C for 20 hours.
Convective IR Reflow Soldering
For more information on IR reflow
soldering, refer to Application Note
1060, Surface Mounting SMT LED
Indicator Components.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-4806EN
AV02-0551EN - March 5, 2012
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