Differential Input DirectDrive
Line Drivers/Headphone Amplifiers
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to PGND.)
SVDD, SVDD2, and PVDD.......................................-0.3V to +6V
PVSS and BIAS........................................................-6V to +0.3V
SGND....................................................................-0.3V to +0.3V
INL-, INL+, INR-, and INR+ (A, B, and E)...-VSVDD/2 to +VSVDD/2
INL-, INL+, INR-,
and INR+ (C and D)........ (-0.75 x VSVDD) to (+0.75 x VSVDD)
OUTL and OUTR...................................................-4.5V to +4.5V
SHDN........................................................................-0.3V to +6V
C1P.........................................................-0.3V to (VPVDD + 0.3V)
C1N........................................................ (VPVSS - 0.3V) to +0.3V
OUT_ Short Circuit to PGND......................................Continuous
OUT_ Short Circuit to PVDD.......................................Continuous
Short Circuit Between OUTL and OUTR....................Continuous
Continuous Current Into/Out of All Pins..............................20mA
Continuous Power Dissipation (TA = +70NC) (Multilayer Board)
TQFN (derate 20.8mW/NC above +70NC)...............1666.7mW
Junction Temperature......................................................+150NC
Operating Temperature Range........................... -40NC to +85NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (qJA)...........48°C/W
Junction-to-Case Thermal Resistance (qJC)..................7°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VPVDD = VSVDD = VSVDD2 = 5V, VPGND = VSGND = 0V, CBIAS = 0.1µF, C1 = C2 = 1µF, RIN = 20kω, RF = 20kω (MAX97220A/
MAX97220B/MAX97220E), typical values tested at TA = +25°C, unless otherwise noted.) (Notes 2 and 3)
PARAMETER
GENERAL
Supply Voltage Range
Quiescent Supply Current
Undervoltage Lockout
Shutdown Supply Current
Turn-On Time
AMPLIFIERS
Input Resistance
Output Signal Attenuation in
Shutdown
Gain
Output Offset Voltage
Input Common-Mode Voltage
Range
Maximum Differential Input Signal
SYMBOL
PVDD,
SVDD_
IPVDD
UVLO
IPVDD_SD
tON
RIN
AV
VOS
VCM
VDIFF
CONDITIONS
MIN
Guaranteed by PSRR test
2.5
No load, TA = +25NC A version
No load, TA = +25NC B/C/D/E versions
No load, VPVDD = VSVDD_ = 3.3V
PVDD falling
SHDN = 0, TA = +25NC
Shutdown to full operation A/C/E versions 4.8
time
B/D versions 117
C/D versions only
VSHDN = 0V,
RL = 10kW
C/D versions only
Unity gain, TA = +25NC
Voltage at IN+ and IN-
(Note 4)
7.4
A/B/E versions
C/D versions
5.5
A/B/E versions
C/D versions
-0.5 x
VPVDD
-0.75 x
VPVDD
TYP
5.5
5
5
1
5.5
130
10
76
71
6
MAX UNITS
5.5
V
7
9
mA
2.35
V
10
FA
6.3
ms
143
12.7
kI
dB
6.5
dB
350
FV
+0.5 x
VPVDD
V
+0.75 x
VPVDD
PVDD VP
2