MW7IC2040NR1 データシートの表示（PDF） - Freescale Semiconductor

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MW7IC2040NR1

RF LDMOS Wideband Integrated Power Amplifiers

Freescale Semiconductor 

PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE

Refer to the following documents to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family

• AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over - Molded Plastic Packages

• AN3789: Clamping of High Power RF Transistors and RFICs in Over - Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

• Electromigration MTTF Calculator

• RF High Power Model

For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the

Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

0

1

Date

Feb. 2009

Nov. 2009

Description

• Initial Release of Data Sheet

• Updated Human Body Model ESD from Class 1C to 1B to reflect Human Body Model actual test data,

p. 2

• Fig. 13, CCDF W - CDMA 3GPP, Test Model 1, 64 DPCH, 45.2% Clipping, Single - Carrier Test Signal and

Fig. 14, Single - Carrier W - CDMA Spectrum updated to show the undistorted input test signal, p. 9

• Added AN3789, Clamping of High Power RF Transistors and RFICs in Over - Molded Plastic Packages to

Product Documentation, Application Notes, p. 28

• Added Electromigration MTTF Calculator and RF High Power Model availability to Product Software,

p. 28

MW7IC2040NR1 MW7IC2040GNR1 MW7IC2040NBR1

28

RF Device Data

Freescale Semiconductor

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