SMBJ5363B データシートの表示（PDF） - Microsemi Corporation
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SMBJ5363B Datasheet PDF : 3 Pages
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8700 E. Thomas Road
Scottsdale, AZ 85252
Tel: (480) 941-6300
Fax: (480) 947-1503
SMBG5333B thru SMBG5388B
and
SMBJ5333B thru SMBJ5388B
Features
• Low profile package for surface mounting (flat handling
surface for accurate placement)
• Zener Voltage 3.3V to 200V
• High Surge Current Capability
• For available tolerances – see note 1
• Available on Tape and Reel (see EIA std RS-481)
Mechanical Data
• Standard JEDEC outlines as shown
• Terminals gull-wing or c-bend (modified J-bend) tin-lead plated
and solderable per MIL-STD-750, method 2026
• Polarity is indicated by cathode band
• Maximum temperature for soldering: 260oC for 10 seconds.
Maximum Ratings @ 25 oC Unless Otherwise Specified
Forward Voltage at 1.0A
VF
1.2 Volts
Current
Steady State Power
Dissipation
Operating and Storage
Temperatures
Thermal Resistance
P(AV)
TJ, TSTG
RθJL
5 Watts
See note 2
-65oC to
+ 150oC
25oC/W
Notes
1. Mounted on copper pads as shown below.
2. Lead temperature at 25oC = TL at mounting plane. Derate
linearly above 25oC to zero power at 150 oC
5 Watt
Surface Mount
Silicon
Zener Diodes
Pad Layout
Gull Wing
0.150
Modified J-Bend
0.089
0.085
Datasheet# MSC0302A
Date: 06/26/97
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