Philips Semiconductors
I2C-bus controlled PAL/NTSC/SECAM TV
processors
PACKAGE OUTLINES
SDIP56: plastic shrink dual in-line package; 56 leads (600 mil)
Tentative Device Specification
TDA884X/5X-N2 series
SOT400-1
L
Z
56
pin 1 index
D
e
b
A2 A
A1
wM
b1
29
ME
c
(e 1)
MH
E
1
28
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.08 0.51
4.0
1.3
0.8
0.53
0.40
0.32
0.23
52.4
51.6
14.0
13.6
1.778 15.24
3.2
2.8
15.80 17.15
15.24 15.90
0.18
2.3
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT400-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-12-06
Fig.33 Plastic shrink dual in-line package; 56 leads (600 mil) SDIP56; SOT400AA1.
December 16, 1997
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