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IPD640N06LG(2006) データシートの表示(PDF) - Infineon Technologies

部品番号
コンポーネント説明
メーカー
IPD640N06LG
(Rev.:2006)
Infineon
Infineon Technologies 
IPD640N06LG Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Parameter
Symbol Conditions
Thermal characteristics
Thermal resistance, junction - case
SMD version, device on PCB
R thJC
R thJA
minimal footprint
6 cm2 cooling area2)
IPD640N06L G
min.
Values
typ.
Unit
max.
-
-
3.2 K/W
-
-
75
-
-
50
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
Transconductance
V (BR)DSS V GS=0 V, I D=1 mA
60
V GS(th) V DS=V GS, I D=16 µA
1.2
I DSS
V DS=60 V, V GS=0 V,
T j=25 °C
-
V DS=60 V, V GS=0 V,
T j=125 °C
-
I GSS
V GS=20 V, V DS=0 V
-
R DS(on) V GS=10 V, I D=18 A
-
V GS=4.5 V, I D=12 A
-
RG
-
g fs
|V DS|>2|I D|R DS(on)max,
I D=18 A
9.5
-
1.6
0.01
1
10
47
64
1.2
19
-V
2
1 µA
100
100 nA
64 m
85
-
-S
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.2
page 2
2006-03-27

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