B32921C3103M003 データシートの表示（PDF） - TDK Corporation

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B32921C3103M003

Film Capacitors EMI Suppression Capacitors (MKP)

TDK Corporation 

B32921C/D ... B32928C/D

X2 / 305 V AC

Immersion depth

Shield

Evaluation criteria:

Visual inspection

ΔC/C0

tan δ

2.0 +0/0.5 mm from capacitor body or seating plane

Heat-absorbing board, (1.5 ±0.5) mm thick, between

capacitor body and liquid solder

No visible damage

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

As specified in sectional specification

1.3 General notes on soldering

Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-

gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit

can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical

characteristics. For short exposures (as in practical soldering processes) the heat load (and thus

the possible effects on a capacitor) will also depend on other factors like:

Pre-heating temperature and time

Forced cooling immediately after soldering

Terminal characteristics:

diameter, length, thermal resistance, special configurations (e.g. crimping)

Height of capacitor above solder bath

Shadowing by neighboring components

Additional heating due to heat dissipation by neighboring components

Use of solder-resist coatings

Please read Cautions and warnings and

Important notes at the end of this document.

Page 17 of 27

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