ELJ-FB1R0JF データシートの表示（PDF） - Panasonic Corporation
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ELJ-FB1R0JF Datasheet PDF : 8 Pages
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Soldering Conditions
■ Reflow soldering conditions
Fixed Inductors (Chip Inductors)
T3
T2
T1
t1
t2
0
Time
● Pb free solder recommended temperature profile
Type
Preheat
T1 [°C]
t1 [s]
Soldering
T2 [°C]
t2 [s]
□F
150 to 180 60 to 120
230 °C
40 max.
□E
150 to 180 60 to 120
230 °C
40 max.
□D
150 to 180 60 to 120
230 °C
40 max.
□C
150 to 180 60 to 120
230 °C
40 max.
□A
150 to 180 60 to 120
230 °C
40 max.
□B
150 to 180 60 to 120
230 °C
40 max.
Peak Temperature
T3
T3 Limit
250 °C, 10 s 260 °C, 10 s
250 °C, 10 s 260 °C, 10 s
245 °C, 10 s 250 °C, 10 s
245 °C, 10 s 250 °C, 10 s
245 °C, 10 s 250 °C, 10 s
245 °C, 10 s 250 °C, 10 s
Time of
Reflow
2 times max.
2 times max.
2 times max.
2 times max.
2 times max.
2 times max.
■ Flow soldering conditions
Preheat: 130 to 150 °C, 60 to 180 s, Soldering: 260 °C, 5 s max.
■ Notes
● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
● In case the product has been stored for a period longer than 6 months, use the product only after confirmation of its
solderability.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Sep. 2012
6
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