AD311 データシートの表示（PDF） - RFHIC

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AD311

E-pHEMT MMIC

RFHIC 

E-pHEMT MMIC

AD311

Package Dimensions (Type: QFN3x3)

* Unit: mm[inch] | Tolerance: ±0.2[.008]

▲ Top View

▲ Side View

▲ Bottom View

Pin No

1

2

3

4

Function

NC

GND

GND

Input

Pin No

5

6

7

8

Pin Description

Function Pin No

Input Matching

9

NC

10

Output-1

11

NC

12

Function

NC

GND

GND

Output-2

Pin No

13

14

15

16

Function

NC

Output-3

NC

NC

* Mounting Configuration Notes

1. Ground / thermal via holes are critical for the proper performance of this device.

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink.

4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink.

5. RF trace width depends upon the PCB material and construction.

6. Use 1 oz. Copper minimum.

Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com

US Facility : 919-677-8780 / sales@rfhicusa.com

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All specifications may change without notice

Version 1.3

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