SG1842Y-DESC データシートの表示（PDF） - Microsemi Corporation

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コンポーネント説明

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SG1842Y-DESC

Current Mode PWM Controller

Microsemi Corporation 

Package Outline Dimensions

Package Outline Dimensions

b

e

L

AQ

6

5

7

4

8

3

9

2

10

1

E

E1

L

c

MILLIMETERS

Dim

MIN MAX

INCHES

MIN

MAX

A

1.45 1.70 0.057

0.067

b

0.25 0.483 0.010

0.019

c

0.102 0.152 0.004

0.006

D

-

7.37

-

0.290

D

E

6.04 6.40 0.238

0.252

E1

-

6.91

-

0.272

e

1.27 BSC

0.050 BSC

S1

L

6.35 9.40 0.250

0.370

Q

0.51 1.02 0.020

0.040

S1

0.20 0.38 0.008

0.015

Notes:

1. Lead No. 1 is identified by tab on lead or dot on cover.

2. Leads are within 0.13mm (.0005”) radius of the true

position (TP) at maximum material condition.

3. Dimension “e” determines a zone within which all body

and lead irregularities lie.

Figure 7 · F 10-Pin Ceramic Flatpack Package Dimensions

E3

D

E

A

L2

A1

3

L

8

1

h

A2

18

B1

13

e

B3

MILLIMETERS

Dim

MIN MAX

INCHES

MIN

MAX

D/E

8.64 9.14 0.340

0.360

E3

-

8.128

-

0.320

e

1.270 BSC

0.050 BSC

B1

0.635 TYP

0.025 TYP

L

1.02 1.52 0.040

0.060

A

1.626 2.286 0.064

0.090

h

1.016 TYP

0.040 TYP

A1

1.372 1.68 0.054

0.066

A2

-

1.168

-

0.046

L2

1.91 2.41 0.075

0.95

B3

Note:

0.203R

0.008R

All exposed metalized area shall be gold plated 60 micro-

inch minimum thickness over nickel plated unless otherwise

specified in purchase order.

Figure 8 · L 20-Pin Leadless Chip Carrier Package Dimensions

23

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