GSD2004S-V データシートの表示（PDF） - Bourns, Inc
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GSD2004S-V Datasheet PDF : 7 Pages
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P500-G and P850-G Series Dual TBU® High-Speed Protectors
Product Dimensions
P500-Gxxx
B
C
A
K
J
K
J
E
FE
N
4
56
H
3
2
1
M
P850-Gxxx
PIN 1
TOP VIEW
B
A
D
SIDE VIEW
N
BOTTOM VIEW
K
J
L
C
G
E
K
L
F
E
J
G
N
4A 4
5
6 6A
HH
3A 3
2
1 1A
M
PIN 1
D
N
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6.
This allows for one PCB layout to accommodate the P500 or P850.
P500-G
P850-G
Dim. Min. Typ. Max. Min. Typ. Max.
A
3.40 4.00 4.10 3.40 4.00 4.10
(.139) (.157) (.161) (.139) (.157) (.161)
B
5.90 6.00 6.10 8.15 8.25 8.35
(.232) (.236) (.240) (.321) (.325) (.329)
C
0.80 0.85 0.90 0.80 0.85 0.90
(.031) (.033) (.035) (.031) (.033) (.035)
D
0.000 0.025 0.050 0.000 0.025 0.050
(.000) (.001) (.002) (.000) (.001) (.002)
E
1.15 1.25 1.35 1.15 1.25 1.35
(.045) (.049) (.053) (.045) (.049) (.053)
F
1.05 1.15 1.25 1.05 1.15 1.25
(.041) (.045) (.049) (.041) (.045) (.049)
G --
--
--
0.725 0.825 0.925
(.029) (.032) (.036)
H
1.10 1.20 1.30 1.10 1.20 1.30
(.043) (.047) (.051) (.043) (.047) (.051)
J
0.375 0.425 0.475 0.375 0.425 0.475
(.015) (.017) (.019) (.015) (.017) (.019)
K
0.70 0.75 0.80 0.25 0.30 0.35
(.028) (.030) (.031) (.010) (.012) (.014)
L --
--
--
0.70 0.75 0.80
(.028) (.030) (.031)
M
0.70 0.75 0.80 0.70 0.75 0.80
(.028) (.030) (.031) (.028) (.030) (.031)
N
0.375 0.425 0.475 0.375 0.425 0.475
(.015) (.017) (.018) (.015) (.017) (.018)
Recommended Pad Layout
DIMENSIONS:
MM
(INCHES)
P500-Gxxx
0.75
1.225
(.030)
(.048) 1.275
(.050)
0.375
(.015)
P850-Gxxx
1.15
(.045)
Pad Designation
Pad # Apply
Block Diagram
1
Tip In
2
NC
P500-Gxxx
3
Tip Out
4
Ring Out
6
4
5
NC
6
Ring In
NC = Solder to PCB; do not make electrical
1
3
connection, do not connect to ground.
0.85
1.225 (.033)
(.048)
0.375
(.015)
0.30
(.012)
1.25
(.049)
1.15
(.045)
0.75
(.030)
Pad #
1A
1
2
3
3A
Pad Designation
Apply
Tip In
Tip In
NC
Tip Out
Tip Out
Pad #
4A
4
5
6
6A
Apply
Ring Out
Ring Out
NC
Ring In
Ring In
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
P850-Gxxx
6 & 6A
1 & 1A
4 & 4A
3 & 3A
TBU® devices have matte-tin termination finish. Suggested layout should use non-solder mask
define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil
opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power
device, it is recommended that, wherever possible, extra PCB copper area is allowed. For
minimum parasitic capacitance, do not allow any signal, ground or power signals beneath any of
the pads of the device.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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