MC100LVEL16
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
Iout
Output Current
VCC = 0 V
VEE = 0 V
VCC = 0 V
Continuous
Surge
VI VCC
VI VEE
−8 to 0
V
6 to 0
V
−6 to 0
V
50
mA
100
mA
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction−to−Ambient) 0 LFPM
500 LFPM
SO−8
SO−8
± 0.5
−40 to +85
−65 to +150
190
130
mA
°C
°C
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SO−8
qJA
Thermal Resistance (Junction−to−Ambient) 0 LFPM
500 LFPM
TSSOP−8
TSSOP−8
41 to 44 ± 5%
185
140
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
DFN8
DFN8
41 to 44 ± 5%
129
84
°C/W
°C/W
°C/W
Tsol
Wave Solder
Pb <2 to 3 sec @ 248°C
Pb−Free <2 to 3 sec @ 260°C
265
°C
265
qJC
Thermal Resistance (Junction−to−Case)
(Note 2)
DFN8
35 to 40
°C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
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