ISL59424, ISL59445
V+ SUPPLY
LOGIC
POWER
GND
SIGNAL
DE-COUPLING
CAPS
V- SUPPLY
SCHOTTKY
PROTECTION
V+
S0
GND V- V+
IN0
IN1
V+
V-
V-
V+
LOGIC
CONTROL
V-
V+
OUT
V-
EXTERNAL
CIRCUITS
FIGURE 19. SCHOTTKY PROTECTION CIRCUIT
HIZ State
An internal pull-down resistor connected to the HIZ pin ensures
the device will be active with no connection to the HIZ pin. The
HIZ state is established within approximately 15ns (Figure 16)
by placing a logic high (>2V) on the HIZ pin. If the HIZ state is
selected, the output is a high impedance 1.4M with
approximately 1.5pF in parallel with a 10µA bias current from
the output. Use this state to control the logic when more than
one mux shares a common output.
In the HIZ state the output is three-stated, and maintains its high
Z even in the presence of high slew rates. The supply current
during this state is basically the same as the active state.
ENABLE and Power Down States
The enable pin is active low. An internal pull-down resistor
ensures the device will be active with no connection to the
ENABLE pin. The Power Down state is established within
approximately 100ns (Figure 14), if a logic high (>2V) is placed
on the ENABLE pin. In the Power Down state, the output has
no leakage but has a large variable capacitance (on the order
of 15pF), and is capable of being back-driven. Under this
condition, large incoming slew rates can cause fault currents of
tens of mA. Do not use this state as a logic control for
applications driving more than one mux on a common
output.
LE State
The ISL59424 is equipped with a Latch Enable pin. A logic
high (>2V) on the LE pin latches the last logic state. This logic
state is preserved when cycling HIZ or ENABLE functions.
Limiting the Output Current
No output short circuit current limit exists on these parts. All
applications need to limit the output current to less than 50mA.
Adequate thermal heat sinking of the parts is also required.
Application Example
Figure 19 illustrates the use of the ISL59445, two ISL84517
SPST switches and one NC7ST00P5X NAND gate to mux 3
different component video signals and one RGB video signal.
The SPDT switches provide the sync signal for the RGB video
and disconnects the sync signal for the component signal.
PC Board Layout
The frequency response of this circuit depends greatly on the
care taken in designing the PC board. The following are
recommendations to achieve optimum high frequency
performance from your PC board.
• The use of low inductance components such as chip
resistors and chip capacitors is strongly recommended.
• Minimize signal trace lengths. Trace inductance and
capacitance can easily limit circuit performance. Avoid sharp
corners, use rounded corners when possible. Vias in the
signal lines add inductance at high frequency and should be
avoided. PCB traces greater than 1" begin to exhibit
transmission line characteristics with signal rise/fall times of
1ns or less. High frequency performance may be degraded
for traces greater than one inch, unless strip line are used.
• Match channel-to-channel analog I/O trace lengths and
layout symmetry. This will minimize propagation delay
mismatches.
• Maximize use of AC de-coupled PCB layers. All signal I/O
lines should be routed over continuous ground planes (i.e.
no split planes or PCB gaps under these lines). Avoid vias in
the signal I/O lines.
• Use proper value and location of termination resistors.
Termination resistors should be as close to the device as
possible.
• When testing use good quality connectors and cables,
matching cable types and keeping cable lengths to a
minimum.
• Minimum of 2 power supply de-coupling capacitors are
recommended (1000pF, 0.01µF) as close to the devices as
possible - Avoid vias between the capacitor and the device
because vias add unwanted inductance. Larger caps can be
farther away. When vias are required in a layout, they should
be routed as far away from the device as possible.
FN7456 Rev 3.00
September 30, 2011
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