XM1001-BD-EV1 データシートの表示（PDF） - M/A-COM Technology Solutions, Inc.

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XM1001-BD-EV1

Image Reject Mixer 12.0-40.0 GHz

M/A-COM Technology Solutions, Inc. 

XM1001-BD

Image Reject Mixer

12.0-40.0 GHz

Mechanical Drawing

1.945

(0.077)

0.831

(0.033)

2

3

1.567

(0.062)

4

0.968

(0.038)

0.364

(0.014)

1

5

0.0

0.0

0.831

1.320

(0.033)

(0.052)

(Note: Engineering designator is 20IRRFM0374)

Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:1.592 mg.

Bond Pad #1 (RF)

Bond Pad #2 (IF1)

Bond Pad #3 (Vg)

Bond Pad #4 (LO)

Bond Pad #5 (IF2)

Bias Arrangement

IF1

2

3

Vg

Bypass Capacitors - See App Note [2]

Rev. V1

4

RF 1

5

IF2

8

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

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