HIP6601B データシートの表示（PDF） - Renesas Electronics

部品番号

コンポーネント説明

メーカー

HIP6601B

Synchronous Rectified BuckMOSFET Drivers

Renesas Electronics 

HIP6601B, HIP6603B, HIP6604B

Package Outline Drawing

M8.15

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

Rev 4, 1/12

INDEX

AREA

1

2

3

TOP VIEW

6.20 (0.244)

5.80 (0.228)

4.00 (0.157)

3.80 (0.150)

DETAIL "A"

1.27 (0.050)

0.40 (0.016)

0.50 (0.20)

0.25 (0.01)

x 45°

8°

0°

0.25 (0.010)

0.19 (0.008)

SIDE VIEW “B”

5.00 (0.197)

4.80 (0.189)

1.27 (0.050)

0.51(0.020)

0.33(0.013)

SIDE VIEW “A

FN9072 Rev 9.00

December 10, 2015

2.20 (0.087)

SEATING PLANE

1.75 (0.069)

1.35 (0.053)

-C-

0.25(0.010)

0.10(0.004)

1

8

0.60 (0.023)

2

7

1.27 (0.050)

3

6

4

5

5.20(0.205)

TYPICAL RECOMMENDED LAND PATTERN

NOTES:

1. Dimensioning and tolerancing per ANSI Y14.5M-1994.

2. Package length does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

3. Package width does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

4. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

5. Terminal numbers are shown for reference only.

6. The lead width as measured 0.36mm (0.014 inch) or greater above the

seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).

7. Controlling dimension: MILLIMETER. Converted inch dimensions are not

necessarily exact.

8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.

Page 14 of 14

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