APW1172
Layout Consideration
1. Please solder the Exposed Pad on the PCB.The heat generated by the power consumption will conduct by
the thermal pad.
2. Please place the input capacitors for VCC pin nearly as close as possible.
3. Connect the switching inductor and the Schottky diode and OUT pin by a wide track.
4. Place the output capacitor close to the inductor as possible and with a wide and short track.
5.The thermal pad is needed to improve the power dissipation.
VOUT = 3.3V
L
22uH
CO U T
100uF
D1
1N5819
R C1
4.3K
CC1
2.2nF
1 OUT
V CC 8
2 SYNC
GND
7
3 INH
VREF 6
4 COMP
FB 5
APW1172
C C2
220pF
R F1
5.6K
VREF = 3.3V
R F2
3.3K
C IN
V IN
22uF 4.8V to 22V
Copyright © ANPEC Electronics Corp.
17
Rev. A.4 - Aug., 2005
www.anpec.com.tw