DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

ISL28288FUZ データシートの表示(PDF) - Renesas Electronics

部品番号
コンポーネント説明
メーカー
ISL28288FUZ Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ISL28288, ISL28488
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
13
5.00 ±0.10
14
8
6.40
4.40 ±0.10
2
3
PIN #1
I.D. MARK
SEE
DETAIL "X"
0.20 C B A
1
7
0.65
B
TOP VIEW
H
C
SEATING
PLANE
0.10 C
0.05
1.20 MAX
0.25 +0.05/-0.06 5
0.10 CBA
SIDE VIEW
0.09-0.20
END VIEW
1.00 REF
0.90 +0.15/-0.10
0.05 MIN
0.15 MAX
DETAIL "X"
GAUGE
PLANE
0.25
0°-8°
0.60 ±0.15
(1.45)
(5.65)
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
FN6339 Rev 4.00
July 26, 2011
Page 19 of 20

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]