NXP Semiconductors
PSMN005-30K
N-channel TrenchMOS SiliconMAX logic level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction mounted on a metal clad board;
to solder point
see Figure 4
Min Typ Max Unit
-
-
20
K/W
102
Zth(j-sp)
(K/W)
03ah04
10 δ = 0.5
0.2
0.1
1 0.05
0.02
P
δ = tp
T
Fig 4.
10−1
10−4
single pulse
10−3
10−2
10−1
tp
t
T
1
10
tp (s)
Transient thermal impedance from junction to mounting base as a function of pulse duration
PSMN005-30K_1
Product data sheet
Rev. 01 — 17 November 2009
© NXP B.V. 2009. All rights reserved.
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