TGF2021-08 データシートの表示（PDF） - Tyco Electronics

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TGF2021-08

DC - 12 GHz Discrete power pHEMT

Tyco Electronics 

Advance Product Information

September 19, 2005

TGF2021-08

Assembly Process Notes

Reflow process assembly notes:

• Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 °C for 30 sec

• An alloy station or conveyor furnace with reducing atmosphere should be used.

• Do not use flux

• Coefficient of thermal expansion matching is critical for long-term reliability.

• Devices must be stored in a dry nitrogen atmosphere.

Component placement and adhesive attachment assembly notes:

• Vacuum pencils and/or vacuum collets are the preferred method of pick up.

• Air bridges must be avoided during placement.

• The force impact is critical during auto placement.

• Organic attachment can be used in low-power applications.

• Curing should be done in a convection oven; proper exhaust is a safety concern.

• Microwave or radiant curing should not be used because of differential heating.

• Coefficient of thermal expansion matching is critical.

Interconnect process assembly notes:

• Thermosonic ball bonding is the preferred interconnect technique.

• Force, time, and ultrasonics are critical parameters.

• Aluminum wire should not be used.

• Devices with small pad sizes should be bonded with 0.0007-inch wire.

• Maximum stage temperature is 200 °C.

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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com

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