TLMB2100(2003) データシートの表示（PDF） - Vishay Semiconductors

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TLMB2100
(Rev.:2003)

MiniLED

Vishay Semiconductors 

TLM.210.

Vishay Semiconductors

Dry Packing

The reel is packed in an anti-humidity bag to protect

the devices from absorbing moisture during

transportation and storage.

Aluminium bag

Label

VISHAY

15973

Reel

17028

Example of JESD22-A112 Level 2 label

Final Packing

The sealed reel is packed into a cardboard box. A

secondary cardboard box is used for shipping

purposes.

Recommended Method of Storage

Dry box storage is recommended as soon as the alu-

minium

bag has been opened to prevent moisture

absorption. The following conditions should be

observed, if dry boxes are not available:

• Storage temperature 10 °C to 30 °C

• Storage humidity ≤ 60 % RH max.

After more than 1 year under these conditions

moisture content will be too high for reflow soldering.

In case of moisture absorption, the devices will

recover

to the former condition by drying under the following

condition:

192 hours at 40 °C +5 °C/ -0 °C and < 5 % RH

(dry air/ nitrogen) or

96 hours at 60 °C +5 °C and < 5 % RH

for all device containers or

24 hours at 100 °C +5 °C

not suitable for reel or tubes.

An EIA JEDEC Standard JESD22-A112 Level 2 label

is included on all dry bags.

ESD Precaution

Proper storage and handling procedures should be

followed to prevent ESD damage to the devices

especially when they are removed from the Antistatic

Shielding Bag. Electro-Static Sensitive Devices

warning labels are on the packaging.

Vishay Semiconductors Standard

Bar-Code Labels

The Vishay Semiconductors standard bar-code labels

are printed at final packing areas. The labels are on

each packing unit and contain Vishay Telefunken

specific

data.

Assembly Instructions

Reflow Soldering

• Reflow soldering must be done within 1 year

stored under max. 30 °C, 60 % RH after opening

envelop

• Recommended soldering paste

(composition: SN 63 %, Pb 37 %)

Melting temperature 178 °C to 192 °C

• Apply solder paste to the specified soldering

pads, by using a dispenser or by screen printing.

• Recommended thickness of metal mask is 0.2 mm

for screen printing.

• The recommended reflow furnace is a

combinationtype with upper and lower heaters.

• Set the furnace temperatures for pre-heating and

heating in accordance with the reflow temperature

profile as shown below. Excercise extreme care to

keep the maximum temperature below 230 °C. The

www.vishay.com

10

Document Number 83199

Rev. A5, 13-Jun-03

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