UPD78C12AGF(A)-XXX-3BE データシートの表示（PDF） - NEC => Renesas Technology

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UPD78C12AGF(A)-XXX-3BE

8-BIT SINGLE-CHIP MICROCOMPUTER (WITH A/D CONVERTER)

NEC => Renesas Technology 

µPD78C10A(A), 78C11A(A), 78C12A(A)

5 9. RECOMMENDED SOLDERING CONDITIONS

Use the following recommended soldering conditions when solder-mounting the µPD78C10A(A), 78C11A(A),

or 78C12A(A).

For details of recommended soldering conditions, see the Semiconductor Device Mounting Technology

Manual (IEI-1207) in the information materials.

Consult your local NEC sales representative concerning soldering methods and conditions other than those

recommended.

Table 9-1. Soldering Conditions for Surface Mounting Types

(1) µPD78C10AGF(A)-3BE

: 64-pin plastic QFP (14 x 20 mm)

µPD78C11AGF(A)-xxx-3BE : 64-pin plastic QFP (14 x 20 mm)

Soldering method

Soldering conditions

Symbol

Infrared ray reflow

VPS

Wave soldering

Pin partial heating

Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C

min.), Number of operations: 2 max.

<Cautions>

(1) Do not start the second reflow until the device has cooled to

normal temperature after the first reflow.

(2) Do not use water for flux cleaning after the first reflow.

Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C

min.), Number of operations: 2 max.

<Cautions>

(1) Do not start the second reflow until the device has cooled to

normal temperature after the first reflow.

(2) Do not use water for flux cleaning after the first reflow.

Solder bath temperature: 260 °C max., Time: 10 seconds max.,

Number of operations: 1

Preheating temperature: 120 °C max. (package surface temperature)

Pin temperature: 300 °C max., Time: 3 seconds max. (per device side)

IR35-00-2

VP15-00-2

WS60-00-1

-

Caution Do not use different soldering methods together (except when one method is pin partial

heating).

(2) µPD78C12AGF(A)-xxx-3BE: 64-pin plastic QFP (14 x 20 mm)

Soldering method

Soldering conditions

Symbol

Infrared ray reflow

VPS

Wave soldering

Pin partial heating

Package peak temperature: 230 °C, Time: 30 seconds max. (210 °C

min.), Number of operations: 1

Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C

min.), Number of operations: 1

Solder bath temperature: 260 °C max., Time: 10 seconds max.,

Number of operations: 1

Preheating temperature: 120 °C max. (package surface temperature)

Pin temperature: 300 °C max., Time: 3 seconds max. (per device side)

IR30-00-1

VP15-00-1

WS60-00-1

-

Caution Do not use different soldering methods together (except when one method is pin partial

heating).

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