LTC2857CMS8-1-PBF データシートの表示（PDF） - Linear Technology

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LTC2857CMS8-1-PBF

20Mbps and Slew Rate Limited 15kV RS485/RS422 Transceivers

Linear Technology 

LTC2856-1/LTC2856-2

LTC2857-1/LTC2857-2

LTC2858-1/LTC2858-2

PACKAGE DESCRIPTION

DD Package

10-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1699)

0.675 p0.05

R = 0.115

TYP

6

0.38 p 0.10

10

3.50 p0.05

1.65 p0.05

2.15 p0.05 (2 SIDES)

PACKAGE

OUTLINE

PIN 1

TOP MARK

(SEE NOTE 6)

0.25 p 0.05

0.50

BSC

2.38 p0.05

(2 SIDES)

0.200 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

3.00 p0.10 1.65 p 0.10

(4 SIDES) (2 SIDES)

0.75 p0.05

0.00 – 0.05

(DD) DFN 1103

5

1

0.25 p 0.05

0.50 BSC

2.38 p0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

285678fe

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