ADSP-BF539 データシートの表示（PDF） - Analog Devices

部品番号

コンポーネント説明

メーカー

ADSP-BF539

Blackfin® Embedded Processor

Analog Devices 

Preliminary Technical Data

ADSP-BF539/ADSP-BF539F

SURFACE MOUNT DESIGN

Table 40 is provided as an aid to PCB design. For industry-

standard design recommendations, refer to IPC-7351,

Generic Requirements for Surface Mount Design and Land Pat-

tern Standard.

Table 40. BGA Data for Use with Surface Mount Design

Package

316-Ball Mini Ball Grid Array (BC-316)

Ball Attach Type

Solder Mask Defined

ORDERING GUIDE

Solder Mask Opening

0.40 mm diameter

Ball Pad Size

0.50 mm diameter

Model1, 2

Temperature

Range3

Package Description

Package Instruction Operating Voltage

Option Rate (Max) (Nominal)

ADSP-BF539WBBCZ-5A –40ºC to +85ºC 316-Ball Mini Ball Grid Array BC-316 500 MHz 1.26 V internal, 3.0 V or 3.3 V I/O

ADSP-BF539WYBCZ-4A –40ºC to +105ºC 316-Ball Mini Ball Grid Array BC-316 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O

ADSP-BF539WBBCZ5F4 –40ºC to +85ºC 316-Ball Mini Ball Grid Array BC-316 500 MHz 1.26 V internal, 3.0 V or 3.3 V I/O

ADSP-BF539WBBCZ5F8 –40ºC to +85ºC 316-Ball Mini Ball Grid Array BC-316 500 MHz 1.26 V internal, 3.0 V or 3.3 V I/O

ADSP-BF539WYBCZ4F4 –40ºC to +105ºC 316-Ball Mini Ball Grid Array BC-316 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O

ADSP-BF539WYBCZ4F8 –40ºC to +105ºC 316-Ball Mini Ball Grid Array BC-316 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O

1 W indicates this product is available for use in specific automotive applications. Contact your local ADI sales office for specific ordering information.

2 Z indicates Pb-free part.

3 Referenced temperature is ambient temperature.

Rev. PrF | Page 65 of 68 | September 2006

Share Link: