GRM219C81C225MA12D データシートの表示（PDF） - Murata Manufacturing

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GRM219C81C225MA12D

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase

　 depending on the sizeand material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

ε=

2Ewh2

Relationship between load and strain

P

Y

h

L

w

ε：Strain on center of board (μst)

L：Distance between supporting points (mm)

w ：Board width (mm)

h ：Board thickness (mm)

E ：Elastic modulus of board (N/m2=Pa)

Y ：Deflection (mm)

P ：Load (N)

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

· As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

· As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

GRM219C81C225MA12-01A

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