GRM219R60J475ME19 データシートの表示（PDF） - Murata Manufacturing

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GRM219R60J475ME19

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

Substrate Bending Test

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Land b

4.5

Series

a

GRM21

100

Solder Resist (Coat with heat resistant resin for solder)

Fig.1 (in mm)

Dimension(mm)

a

b

c

1.2

4.0

1.65

*1,2：2.0±0.05

4.0±0.1

・Pressurization Method

20

50min.

Pressurization speed

1.0mm/s

Pressurize

R5

Support

Capacitance meter

45

45

Fig.2 (in mm)

Flexure

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady), Durability

・Test Substrate

Material : JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)

Thickness :

1.6mm or 0.8mm

Copper Foil Thickness: 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

Chip Capacitor

Land

a

b

Fig.3

Solder Resist

Series

GRM21

Dimension(mm)

a

b

c

1.2

4.0

1.65

GRM219R60J475ME19-01A

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