MCP23008_05 데이터 시트보기 (PDF) - Unspecified

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MCP23008_05

8-Bit I/O Expander with Serial Interface

Unspecified 

MCP23008/MCP23S08

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. – X

/XX

Device

Temperature Package

Range

Device

Temperature

Range

MCP23008:

MCP23008T:

MCP23S08:

MCP23S08T:

8-Bit I/O Expander w/ I2C™ Interface

8-Bit I/O Expander w/ I2C Interface

(Tape and Reel)

8-Bit I/O Expander w/ SPI™ Interface

8-Bit I/O Expander w/ SPI Interface

(Tape and Reel)

E = -40°C to +125°C (Extended) *

* While these devices are only offered in the “E”

temperature range, the device will operate at different

voltages and temperatures as identified in the

Section 2.0 “Electrical Characteristics”.

Package

P=

SO =

SS =

Plastic DIP (300 mil Body), 18-Lead

Plastic SOIC (300 mil Body), 18-Lead

SSOP, (209 mil Body, 5.30 mm), 20-Lead

Examples:

a) MCP23008-E/P: Extended Temp.,

18LD PDIP package.

b) MCP23008-E/SO: Extended Temp.,

18LD SOIC package.

c) MCP23008T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

d) MCP23008-E/SS: Extended Temp.,

20LD SSOP package.

e) MCP23008T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

a) MCP23S08-E/P: Extended Temp.,

18LD PDIP package.

b) MCP23S08-E/SO: Extended Temp.,

18LD SOIC package.

c) MCP23S08T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

d) MCP23S08-E/SS: Extended Temp.,

20LD SSOP package.

e) MCP23S08T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

© 2005 Microchip Technology Inc.

DS21919B-page 37

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