FCRN3031003JA 데이터 시트보기 (PDF) - California Micro Devices => Onsemi
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FCRN3031003JA
California Micro Devices => Onsemi
FCRN3031003JA Datasheet PDF : 2 Pages
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CALIFORNIA MICRO DEVICES
FCRN303
RESISTANCE RANGE
40KΩ to 150KΩ
Parameter
TCR
Operating Voltage
Power Rating
Absolute Tolerance
Operating Temperature Range
Storage Temperature
ELECTRICAL SPECIFICATIONS
Test Condition
–55°C to +125°C
±25ppm/°C
–55°C to +125°C
100Vdc
@ 70°C
200mW
+25°C
±0.1%
–55°C to +125°C
–65°C to +150°C
Max
Max
Max
Max
Final Die Size
Die Thickness (Die & Bump)
Pad Size
Pad Pitch
Bump Height
Die Substrate
CSP SPECIFICATIONS
2.032 x 1.272mm (±0.125mm)
0.500mm (±0.075mm)
0.381 x 1.135mm
1.514mm nominal
0.125mm (±0.025mm)
Ceramic
80 x 50 mil (±5 mil)
20 mil (±3 mil)
15 x 44.6 mil
59.6 mil nominal
5 mil (±1 mil)
Ceramic
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
Solder Paste
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com 7/11/2000
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