90
80
BOTH LEADS TO HEAT SINK,
EQUAL LENGTH
70
60
MAXIMUM
50
TYPICAL
40
30
20
10
0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0
L, LEAD LENGTH (INCHES)
Figure 5. Steady–State Thermal Resistance
NOTE 3 — MOUNTING DATA:
Data shown for thermal resistance junction–to–ambient
(RθJA) for the mounting shown is to be used as a typical
guideline values for preliminary engineering or in case the tie
point temperature cannot be measured.
Typical Values for RθJA in Still Air
Mounting
Method
Lead Length, L (in)
1/8 1/4 1/2 3/4
1
52
65
72
85
2
67
80
87 100
3
—
50
RθJA
°C/W
°C/W
°C/W
NOTE 4 — THERMAL CIRCUIT MODEL:
(For heat conduction through the leads)
RθS(A) RθL(A) RθJ(A)
TA(A)
TL(A)
TC(A) TJ
RθJ(K) RθL(K) RθS(K)
PD
TC(K)
TA(K)
TL(K)
Use of the above model permits junction to lead thermal
resistance for any mounting configuration to be found. For a
given total lead length, lowest values occur when one side of
the rectifier is brought as close as possible to the heat sink.
Terms in the model signify:
TA = Ambient Temperature TC = Case Temperature
TL = Lead Temperature
TJ = Junction Temperature
RθS = Thermal Resistance, Heat Sink to Ambient
RθL = Thermal Resistance, Lead to Heat Sink
RθJ = Thermal Resistance, Junction to Case
PD = Power Dissipation
MBR150 MBR160
200
TJ = 25°C
f = 1 MHz
100
80
70
60
50
40
30
20
0 10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance
Mounting Method 1
Mounting Method 3
P.C. Board with
P.C. Board with
1–1/2″ x 1–1/2″
1–1/2″ x 1–1/2″
copper surface.
L
L
ÉÉÉÉÉÉÉ
copper surface.
É L = 3/8″
ÉÉÉ BOARD GROUND
É PLANE
Mounting Method 2
ÉÉÉÉLÉÉÉÉÉÉLÉÉÉÉÉÉ
VECTOR PIN MOUNTING
(Subscripts A and K refer to anode and cathode sides,
respectively.) Values for thermal resistance components are:
RθL = 100°C/W/in typically and 120°C/W/in maximum.
RθJ = 36°C/W typically and 46°C/W maximum.
NOTE 5 — HIGH FREQUENCY OPERATION:
Since current flow in a Schottky rectifier is the result of ma-
jority carrier conduction, it is not subject to junction diode for-
ward and reverse recovery transients due to minority carrier
injection and stored charge. Satisfactory circuit analysis work
may be performed by using a model consisting of an ideal
diode in parallel with a variable capacitance. (See Figure 6.)
Rectification efficiency measurements show that operation
will be satisfactory up to several megahertz. For example,
relative waveform rectification efficiency is approximately 70
percent at 2 MHz, e.g., the ratio of dc power to RMS power in
the load is 0.28 at this frequency, whereas perfect rectifica-
tion would yield 0.406 for sine wave inputs. However, in con-
trast to ordinary junction diodes, the loss in waveform effi-
ciency is not indicative of power loss: it is simply a result of
reverse current flow through the diode capacitance, which
lowers the dc output voltage.
Rectifier Device Data
3