MCIMX535DVV1C 데이터 시트보기 (PDF) - Freescale Semiconductor

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MCIMX535DVV1C

i.MX53xD Applications Processors for Consumer Products

Freescale Semiconductor 

1.1 Ordering Information

Table 1 provides ordering information.

Table 1. Ordering Information

Part Number1

Mask Set

Features

Case

Tempera

ture

Range

(°C)

Introduction

Package2

PCIMX535DVV1C

N78C

1 GHz, full feature set

-20 to

+85

MCIMX535DVV1C

N78C

1 GHz, full feature set

-20 to

+85

PCIMX538DZK1C

N78C

1 GHz, full feature set

-20 to

+85

MCIMX538DZK1C

N78C

1 GHz, full feature set

-20 to

+85

1 Part numbers with a PC prefix indicate non production engineering parts.

2 Case TEPBGA-2 is RoHS compliant, lead-free MSL (moisture sensitivity level) 3.

19 x 19 mm, 0.8 mm pitch BGA

Case TEPBGA-2

19 x 19 mm, 0.8 mm pitch BGA

Case TEPBGA-2

12 x 12 mm PoP

12 x 12 mm PoP

1.2 Features

The i.MX53xD multimedia applications processor (AP) is based on the ARM Platform, which has the

following features:

• MMU, L1 instruction and L1 data cache

• Unified L2 cache

• Target frequency of the core (including Neon, VFPv3 and L1 cache): 1 GHz

• Neon coprocessor (SIMD media processing architecture) and vector floating point (VFP-Lite)

coprocessor supporting VFPv3

• TrustZone

The memory system consists of the following components:

• Level 1 cache:

— Instruction (32 Kbyte)

— Data (32 Kbyte)

• Level 2 cache:

— Unified instruction and data (256 Kbyte)

• Level 2 (internal) memory:

— Boot ROM, including HAB (64 Kbyte)

— Internal multimedia/shared, fast access RAM (128 Kbyte)

— Secure/non-secure RAM (16 Kbyte)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

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