AD768
WAFER TEST LIMITS1
(TA = +25؇C, VDD = +5.0 V, VEE = –5.0 V, IREFIN = 5 mA, unless otherwise noted)
Parameter
Integral Nonlinearity2
Differential Nonlinearity2
Offset Error
Gain Error
Reference Voltage
Positive Supply Current
Negative Supply Current
Power Dissipation
AD768ACHIPS Limit
±8
±6
± 0.2
± 1.0
± 1.0
40
73
600
Units
LSB max
LSB max
% FSR max
% FSR max
% of nom. 2.5 V max
mA max
mA max
mW max
NOTES
1Electrical test are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal
yield loss, yield after packaging is not guaranteed for standard product dice.
2Limits extrapolated from testing of individual bit errors.
3Die offers latch control pad. Edge triggered latches become level triggered when latch control and clock pads are high.
4Die substrate is connected to VEE.
PIN DESCRIPTIONS
Pin No. Symbol
Type
Name and Function
1
2
3
4
5
6
7
8–14
15
16
17–23
24
25
26
27
28
IOUTA
AO
NR
AI
REFOUT
AO
NC
NC
REFCOM
P
IREFIN
AI
DB0
DI
DB1–DB7
DI
DCOM
P
CLOCK
DI
DB8–DB14 DI
DB15
DI
VDD
P
VEE
P
IOUTB
AO
LADCOM
P
DAC Current Output. Full-scale current when all data bits are 1s.
Noise Reduction Node. Add capacitor for noise reduction.
Reference Output Voltage. Nominal value is 2.5 V.
No Connect. Reserved for internal use.
Reference Ground.
Reference Input Current. Nominal is 5 mA. DAC full-scale is 4× this current.
Data Bit 0 (LSB).
Data Bits 1–7.
Digital Ground.
Clock Input. Data latched on positive edge of clock.
Data Bits 8–14.
Data Bit 15 (MSB).
Positive Supply Voltage. Nominal is +5 V.
Negative Supply Voltage. Nominal is –5 V.
Complementary DAC Current Output. Full-scale current when all data bits are 0s.
DAC Ladder Common.
Type: AI = Analog Input; DI = Digital Input; AO = Analog Output; P = Power.
PIN CONFIGURATION
IOUTA 1
28 LADCOM
NR 2
27 IOUTB
REFOUT 3
NC 4
REFCOM 5
26 VEE (–5V)
25 VDD (+5V)
24 DB15 (MSB)
IREFIN 6 AD768 23 DB14
(LSB) DB0 7 TOP VIEW 22 DB13
(Not to Scale)
DB1 8
21 DB12
DB2 9
20 DB11
DB3 10
19 DB10
DB4 11
18 DB9
DB5 12
17 DB8
DB6 13
16 CLOCK
DB7 14
15 DCOM
NC = NO CONNECT
DICE CHARACTERISTICS3, 4
VDD VDD
DB15 DB14 DB13 DB12 DB11 DB10
VEE
DB9
VEE
DB8
IOUTB
LADCOM
IOUTA
NR
REFOUT
NC
REFCOM IREFIN
DB0 DB1 DB2 DB3 DB4
CLOCK
LATCH CONTROL
DCOM
DB7
DB6
DB5
Die Size:
0.1106 × 0.1417 inch, 15,672 sq. mils
(2.81 × 3.60 mm, 10.116 sq. mm)
–4–
REV. B