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AK8850 데이터 시트보기 (PDF) - Asahi Kasei Microdevices

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AK8850
AKM
Asahi Kasei Microdevices 
AK8850 Datasheet PDF : 99 Pages
First Prev 91 92 93 94 95 96 97 98 99
ASAHI KASEI
10. Package 100pin LQFP
75
76
16.0 ± 0.2
14.0
[AK8850]
1.70 Max
1.40
51
50
0.20 Max
100
1
0.5
0.22 ± 0.05
26
25
0.10 M
0.17 ± 0.05
1.0
0.10
0.5 ± 0.2
Package & Lead frame material
Package molding compound Epoxy
Lead frame material
Cu
Lead frame surface treatment: Solder plate
0 ~ 10°
Rev.0
97
2003/01

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