BTA208S-800B 데이터 시트보기 (PDF) - NXP Semiconductors.

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BTA208S-800B

3Q Hi-com Triac

NXP Semiconductors. 

NXP Semiconductors

BTA208S-800B

3Q Hi-com Triac

5. Thermal characteristics

Table 5.

Symbol

Rth(j-mb)

Rth(j-a)

Thermal characteristics

Parameter

thermal resistance from junction to

mounting base

thermal resistance from junction to

ambient

Conditions

full cycle; see Figure 6

half cycle; see Figure 6

in free air; printed circuit board

(FR4) mounted

Min Typ Max Unit

-

-

2

K/W

-

-

2.4 K/W

-

75

-

K/W

10

Zth(j-mb)

(K/W)

1

10−1

unidirectional

bidirectional

003aaf584

P

10−2

10−5

10−4

10−3

10−2

10−1

tp

t

1

10

tp (s)

Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width

BTA208S-800B

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 03 — 14 April 2011

© NXP B.V. 2011. All rights reserved.

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