C167CS-xC Bare Die
Step BA
• Supported by a Large Range of Development Tools like C-Compilers,
Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers,
Simulators, Logic Analyzer Disassemblers, Programming Boards
• On-Chip Bootstrap Loader
This document describes several derivatives of the C167 group. Table 1 enumerates
these derivatives and summarizes the differences. As this document refers to all of these
derivatives, some descriptions may not apply to a specific product.
Table 1
C167CS-xC Bare Die Derivative Synopsis
Type
Ordering
Code
Program
Memory
Operating
Wafers
Temperature
SAK-C167CS-4RC
Q67120-
D....
32 KByte ROM -40 to +125 °C Whole
SAK-C167CS-LC
Q67120-
---
C2200
SAL-C167CS-LC1)
Q67120-
---
C2274
SAL-C167CS-L33C1) Q67120-
---
C2275
-40 to +125 °C Sawn
-40 to +150 °C Sawn
-40 to +150 °C Sawn
1) The designation SAL-… conforms to the valid ProElectron specification. These devices were named SAA-…
formerly.
Note: The ordering codes for Mask-ROM versions are defined for each product after
verification of the respective ROM code.
For simplicity all versions are referred to by the term C167CS-xC throughout this
document.
Data Sheet
2
V1.0, 2001-08