US3010/3010A
US3010/3010A and SC1152 Dual Layout Parts List
Ref Desig Description
Qty
Q1
MOSFET
1
Q2
MOSFET
1
L1
Inductor
1
L2
Inductor
1
C10
Capacitor ,Electrolytic
5
C3
Capacitor ,Electrolytic
2
C1
Capacitor ,Electrolytic
1
C2
Capacitor , Ceramic
1
C5
Capacitor , Ceramic
1
C4,6
Capacitor , Ceramic
2
C9
Capacitor , Ceramic
1
C7
Capacitor , Ceramic
1
C11
Capacitor , Ceramic
1
C8
Capacitor , Ceramic
1
R2
Resistor
1
R3
Resistor
1
R4
Resistor
1
R5
Resistor
1
R6
Resistor
1
R8
Resistor
1
R1,7,9, Resistor
5
10,11
R12,13 Resistor
2
HS1
Q1 Heatsink
1
HS2
Q2 Heatsink
1
Part #
IRL3103
IRL3103S (Note 1)
IRL3103
IRL3103S (Note 1)
L=1 uH
Core
L=2.5 uH R=2 mohm
6MV1500GX ,1500uF,6.3V,
6MV1500GX ,1500uF,6.3V,
680uF,10V, EEUFA1A681L
1 uF , SMT
220 pF , SMT
1 uF , SMT
150 pF , X7R, SMT
470pF , SMT
0.01 uF , SMT
open , SMT
2.21 kΩ , 1% ,SMT
10Ω , 5%, SMT , 1206 size
Short, SMT
10Ω , 5%, SMT , 1206 size
10Ω , 5%, SMT , 1206 size
short , #20 AWG wire
open , SMT
100 kΩ , 5%, SMT
6270
6270
Manuf
IR
IR
Micro Metal
Sanyo
Sanyo
Panasonic
Thermalloy
Thermalloy
Note 1 : For the applications where it is desirable not to use the Heatsink, the IRL3103S MOSFET in the TO263
SMT package with 1″ square of pad area using top and bottom layers of the board as a minimum is required.
Rev. 1.1
5/18/98
4-7