Application information
2
Application information
EMIF02-USB02F2
Figure 7. Aplac model of D+ & D- cells
C1
650
650
A3
+
0.8pF
+
Csub
+
Csub
+
Csub
+ 0.8pF
rsub_1k3
rsub_1k3
D2
C1 or E1
MODEL = D02_usb
MODEL = D02_usb
+
0.8pF
bulk
16.5
16.5
+
Csub
+
Csub
+
Csub
rsub_33R
rsub_33R
+ 0.8pF
MODEL = D02_5p
Rsub_D
MODEL = D02_5p
Rsub_D
C3 or E3
Cbump Rbump
+
I/O
MODEL = D02_usb
D2
MODEL = D02_usb
100m
bulk
bulk
50pH
50m
Lhole
100m
D2
D2
bulk
Figure 8.
Aplac model parameters
Cz 17pF opt
Ls 0.4nH
Rs 0.1
Rsub_D 10
Csub 0.3pF
Rsub_33R 16
Rsub_1k3 18
lhole 170pH opt
Cbump 1.2pF opt
Rbump 350
D02_usb diodes model
+ BV = 7
+ IBV = 1m
+ CJO = Cz
+ M = 0.3333
+ RS = 2
+ VJ = 0.6
+ TT = 100n
D02_5p diodes model
+ BV = 100
+ IBV = 1m
+ CJO = 5p
+ M = 0.3333
+ RS = 2
+ VJ = 0.6
+ TT = 100n
3
Ordering information scheme
Figure 9. Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x 2: Lead free, pitch = 500 µm, bump = 315 µm
4/7