HY27US(08/16)561A Series
HY27SS(08/16)561A Series
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
MARKING INFORMATION - FBGA
Packag
M arking Exam ple
FBGA
K
O
R
H
Y
2
7
x
S
x
x
5
6
x
A
x
x
x
x
Y WW
x
x
- hynix
: Hynix Sym bol
- KOR
- HY27xSxx56xA xxxx
: Origin Country
: Part Num ber
HY: HYNIX
27: NAND Flash
x: Pow er Supply
S: Classification
xx: Bit Organization
56: Density
x: Mode
A: Version
: U(2.7V~3.6V), L(2.7V), S(1.8V)
: Single Level Cell+ Single Die+ Sm all Block
: 08(x8), 16(x16)
: 256M bit
: 1(1nCE & 1R/nB; Sequential Row Read Enable)
2(1nCE & 1R/nB; Sequential Row Read Disable)
: 2nd Generation
x: Package Type
x: Package M aterial
x: Operating Tem perature
: F(63FBGA)
: Blank(Norm al), P(Lead Free)
: C(0℃ ~70℃ ), E(-25℃ ~85℃ )
M(-30℃ ~85℃ ), I(-40℃ ~85℃ )
x: Bad Block
: B(Included Bad Block), S(1~ 5 Bad Block),
P(All Good Block)
- Y: Year (ex: 5=year 2005, 06= year 2006)
- w w : W ork W eek (ex: 12= work week 12)
- xx: Process Code
Note
- Capital Letter
- Sm all Letter
: Fixed Item
: Non-fixed Item
Rev 0.5 / Jun. 2006
47