HFA1109IB(1997) 데이터 시트보기 (PDF) - Intersil

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HFA1109IB
(Rev.:1997)

450MHz, Low Power, Current Feedback Video Operational Amplifier

Intersil 

Die Characteristics

DIE DIMENSIONS:

59 mils x 80 mils x 19 mils

1500µm x 2020µm x 483µm

METALLIZATION:

Type: Metal 1: AICu(2%)/TiW

Thickness: Metal 1: 8kÅ ±0.4kÅ

Type: Metal 2: AICu(2%)

Thickness: Metal 2: 16kÅ 0.8kÅ

Metallization Mask Layout

HFA1109

GLASSIVATION:

Type: Nitride

Thickness: 4kÅ ±0.5kÅ

TRANSISTOR COUNT:

130

SUBSTRATE POTENTIAL (Powered Up):

Floating (Recommend Connection to V-)

HFA1109

NC

NC

NC

NC

-IN

+IN

V-

V+

OUT

NC

NC

NC NC

10

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