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IRF6631TR1 데이터 시트보기 (PDF) - International Rectifier

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IRF6631TR1
IR
International Rectifier 
IRF6631TR1 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
IRF6631
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
™ Power Dissipation
™ Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
™g Junction-to-Ambient
dg Junction-to-Ambient
eg Junction-to-Ambient
fg Junction-to-Case
Junction-to-PCB Mounted
™Ã Linear Derating Factor
Max.
2.2
1.4
42
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.4
0.017
Max.
58
–––
–––
3.0
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
1
0.1
0.01
0.001
1E-006
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
0.001
τJ τJ
τ1 τ1
R1R1
R2R2
τ2 τ2
R3R3
τ3 τ3
R4R4
τ4 τ4
R5R5
τ5 τ5
τAτA
Ri (°C/W)
1.6195
2.14056
22.2887
τi (sec)
0.000126
0.001354
0.375850
Ci= τi/Ri
Ci= τi/Ri
20.0457 7.41
11.9144 99
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
 Surface mounted on 1 in. square Cu board, steady state.
‚ Used double sided cooling , mounting pad.
ƒ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
„ TC measured with thermocouple incontact with top (Drain) of part.
… Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
‚ Mounted to a PCB with
small clip heatsink (still air)
ƒ Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3

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