IS42S32400B
ISSI ®
AC ELECTRICAL CHARACTERISTICS (1,2,3)
Symbol Parameter
tCK3
Clock Cycle Time
tCK2
tAC3
Access Time From CLK
tAC2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
-6
Min. Max.
6
—
8
—
— 5.4
— 6.5
-7
Min. Max.
7
—
10 —
— 5.4
— 6.5
Units
ns
ns
ns
ns
tCHI
CLK HIGH Level Width
2.5 —
2.5 —
ns
tCL
CLK LOW Level Width
2.5 —
2.5 —
ns
tOH3
Output Data Hold Time
CAS Latency = 3
2.7 —
2.7 —
ns
tOH2
CAS Latency = 2
2.7 —
3
—
ns
tLZ
Output LOW Impedance Time
0
—
0
—
ns
tHZ
Output HIGH Impedance Time
2.7 5.4
2.7 5.4
ns
tDS
Input Data Setup Time(2)
1.5 —
1.5 —
ns
tDH
Input Data Hold Time(2)
0.8 —
0.8 —
ns
tAS
Address Setup Time(2)
1.5 —
1.5 —
ns
tAH
Address Hold Time(2)
0.8 —
0.8 —
ns
tCKS
CKE Setup Time(2)
1.5 —
1.5 —
ns
tCKH
CKE Hold Time(2)
0.8 —
0.8 —
ns
tCS
Command Setup Time (CS, RAS, CAS, WE, DQM)(2)
1.5 —
1.5 —
ns
tCH
Command Hold Time (CS, RAS, CAS, WE, DQM)(2)
0.8 —
0.8 —
ns
tRC
Command Period (REF to REF / ACT to ACT)
60 —
67.5 —
ns
tRAS
Command Period (ACT to PRE)
42 100K
45 100K
ns
tRP
Command Period (PRE to ACT)
18 —
20 —
ns
tRCD
Active Command To Read / Write Command Delay Time 18
—
20 —
ns
tRRD
Command Period (ACT [0] to ACT[1])
12 —
14 —
ns
tDPL
Input Data To Precharge
Command Delay time
12 —
14 —
ns
tDAL
Input Data To Active / Refresh
30 —
34 —
ns
Command Delay time (During Auto-Precharge)
tMRD
Mode Register Program Time
12 —
15 —
ns
tDDE
Power Down Exit Setup Time
6
—
7.5 —
ns
tXSR
Self-Refresh Exit Time
70 —
70 —
ns
tT
Transition Time
1
10
1
10
ns
tREF
Refresh Cycle Time (4096)
— 64
— 64
ms
Notes:
1. The power-on sequence must be executed before starting memory operation.
2. Measured with tT = 1 ns. If clock rising time is longer than 1ns, (tR /2 - 0.5) ns should be added to the parameter.
3. The reference level is 1.4V when measuring input signal timing. Rise and fall times are measured between VIH(min.) and VIL (max).
16
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
PRELIMINARY INFORMATION Rev. 00G
06/15/06