ISD2548E 데이터 시트보기 (PDF) - Winbond

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ISD2548E

SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION

Winbond 

ISD2532/40/48/64

12.4. DIE BONDING PHYSICAL LAYOUT [1]

ISD2532/40/48/64

o Die Dimensions

X: 149.6 + 1 mils

Y: 206.3 + 1 mils

o Die Thickness [2]

11.8 + .4 mils

o Pad Opening

111 microns (4.4 mils)

A3 A1

VCCD XCLK

A2 A0

P/R EOM

PD

A4

CE

A5

A6

OVF

ISD2532/40/48/64

≈

≈

NC

ANA OUT

A7

ANA IN

A8

AUX IN

VSSA

SP- MIC

AGC

VSSD

SP+

VCCA MIC REF

Notes:

[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may

occur.

[2] Die thickness is subject to change, please contact Winbond factory for status and availability.

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