L78M00(2006) 데이터 시트보기 (PDF) - STMicroelectronics
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L78M00 Datasheet PDF : 30 Pages
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Package mechanical data
L78M00 series
Table 13. DPAK MECHANICAL DATA
TYPE STD-ST
TYPE FUJITSU-SUBCON.
TYPE IDS-SUBCON
DIM.
mm.
mm.
mm.
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.20
2.40
2.25
2.30
2.35
2.19
2.38
A1
0.90
1.10
0.96
1.06
0.89
1.14
A2
0.03
0.23
0
0.10
0.03
0.23
b
0.64
0.90
0.76
0.86
0.64
0.88
b4
5.20
5.40
5.28
5.38
5.21
5.46
c
0.45
0.60
0.46
0.56
0.46
0.58
c2
0.48
0.60
0.46
0.56
0.46
0.58
D
6.00
6.20
6.05
6.15
5.97
6.22
D1
5.10
5.27
5.47
5.20
E
6.40
6.60
6.55
6.60
6.65
6.35
6.73
E1
4.70
4.77
4.70
e
2.28
2.23
2.28
2.33
2.28
e1
4.40
4.60
4.51
4.61
H
9.35
10.10
9.90
10.30
9.40
10.42
L
1.00
1.40
1.60
0.90
L1
2.80
2.50
2.65
L2
0.80
1.03
1.13
0.89
1.27
L4
0.60
1.00
0.70
0.90
0.64
1.02
R
0.20
0.40
0.20
V2
0°
8°
0°
8°
0°
8°
Note:
The DPAK package coming from the two subcontractors (Fujitsu and IDS) are fully
compatible with the ST's package suggested footprint.
24/30
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