LTC1860LCS8 데이터 시트보기 (PDF) - Linear Technology
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LTC1860LCS8 Datasheet PDF : 12 Pages
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LTC1860L/LTC1861L
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
0.52
(.206)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.254
(.010)
GAUGE PLANE
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.18
NOTE:
(.077)
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
DETAIL “A”
0° – 6° TYP
4.90 ± 0.15
(1.93 ± .006)
0.53 ± 0.015
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.86
(.034)
REF
0.13 ± 0.076
(.005 ± .003)
MSOP (MS8) 0802
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.254
(.010)
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
0.18
NOTE:
(.007)
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
DETAIL “A”
0° – 6° TYP
0.53 ± 0.01
(.021 ± .006)
DETAIL “A”
4.90 ± 0.15
(1.93 ± .006)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
12345
1.10
(.043)
MAX
0.86
(.034)
REF
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.13 ± 0.076
(.005 ± .003)
MSOP (MS) 0802
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
.245
MIN
.045 ±.005
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
.160 ±.005
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
.228 – .244
(5.791 – 6.197)
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
1
2
34
.150 – .157
(3.810 – 3.988)
NOTE 3
SO8 0303
18601Lf
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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