MAX16903 데이터 시트보기 (PDF) - Maxim Integrated

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MAX16903

2.1MHz, High-Voltage, 1A Mini-Buck Converter

Maxim Integrated 

MAX16903

2.1MHz, High-Voltage,

1A Mini-Buck Converter

Absolute Maximum Ratings

(Voltages referenced to GND.)

SUP, EN.................................................................-0.3V to +42V

BST to LX..................................................................-0.3V to +6V

LX.............................................................-0.3V to (VSUP + 0.3V)

BST.........................................................................-0.3V to +47V

OUTS......................................................................-0.3V to +12V

SYNC, PGOOD, BIAS............................................-0.3V to +6.0V

PGND to GND .......................................................-0.3V to +0.3V

LX Continuous RMS Current.................................................1.5A

OUTS Short-Circuit Duration......................................Continuous

ESD Protection

Human Body Model .........................................................±2kV

Machine Model ..............................................................±200V

Continuous Power Dissipation (TA = +70°C)

TDFN (derate 24.4 mW/°C above +70°C)..................1951mW

TSSOP (derate 26.1 mW/°C above +70°C) ..............2089mW

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 1)

TDFN

Junction-to-Ambient Thermal Resistance (θJA)...........41°C/W

Junction-to-Case Thermal Resistance (θJC)..................9°C/W

TSSOP

Junction-to-Ambient Thermal Resistance (θJA)........38.3°C/W

Junction-to-Case Thermal Resistance (θJC)..................3°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VSUP = +14V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.)

PARAMETER

Supply Voltage Range

Supply Current

UV Lockout

Bias Voltage

Bias Current Limit

SYMBOL

CONDITIONS

VSUP

(Note 2)

t < 1s

EN = low

ISUP

EN = high, no load

3.3V and 5V output

1.8V output

EN = high, continuous, no switching

VUVLO

VUVLO,HYS

VBIAS

IBIAS

Bias rising

Hysteresis

+5.5V ≤ VSUP ≤ +42V

MIN TYP MAX UNITS

3.5

28

V

42

4

8

25

35

µA

40

65

90

1

mA

2.8

3

3.2

V

0.4

5

V

10

mA

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