MC74LVX374MELG(2011) 데이터 시트보기 (PDF) - ON Semiconductor
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MC74LVX374MELG Datasheet PDF : 8 Pages
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MC74LVX374
ORDERING INFORMATION
Device
Package
Shipping†
MC74LVX374DWR2G
SOIC−20
(Pb−Free)
1000 Tape & Reel
MC74LVX374DTR2G
TSSOP−20*
2500 Tape & Reel
MC74LVX374MG
SOEIAJ−20
(Pb−Free)
50 Units / Rail
MC74LVX374MELG
SOEIAJ−20
(Pb−Free)
2000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
CP
50%
tW
1/fmax
tPLH
tPHL
O
50% VCC
Figure 3.
D
CP
SWITCHING WAVEFORMS
VCC
OE
50%
GND
O
O
VALID
50%
tsu
th
50%
Figure 5.
tPZL
tPLZ
50% VCC
tPZH tPHZ
50% VCC
Figure 4.
VCC
GND
VCC
GND
VCC
GND
HIGH
IMPEDANCE
VOL +0.3V
VOH -0.3V
HIGH
IMPEDANCE
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
CL*
TEST CIRCUITS
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
1 kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 6. Propagation Delay Test Circuit
*Includes all probe and jig capacitance
Figure 7. Three−State Test Circuit
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