Typical Performance Curves
RF1K49156
1.2
1.0
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT
TEMPERATURE
7
6
5
4
3
2
1
0
25
50
75
100
125
150
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
10
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
1
0.02
0.01
PDM
0.1
0.01
10-3
SINGLE PULSE
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION (s)
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
102
103
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
100
TJ = MAX RATED, TA = 25oC
VDSS MAX = 30V
10
5ms
1
10ms
0.1
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON)
0.01
0.1
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
100ms
1s
DC
100
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
200
100
VGS = 5V
10
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
I = I25 150 - TA
125
TA = 25oC
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
1
10-5
10-4
10-3
10-2
10-1
100
101
t, PULSE WIDTH (s)
FIGURE 5. PEAK CURRENT CAPABILITY
©2002 Fairchild Semiconductor Corporation
RF1K49156 Rev. B